As a world leader in thermal management solutions, Laird Technologies offers the Tlam™ thermally-conductive PCB substrate system. Tlam™ thermally-conductive PCB substrates provide 8-10 times the heat dissipation compared to conventional FR4-based PCBs. The miniaturation of electronic devices continues to pack more and more power into smaller and smaller packages. The simplicity of the Tlam™ system takes the heat dissipation requirement in stride without significant design changes. The Tlam™ dielectrics are the key to these high-performance PCB substrates. The Tlam™ dielectric provides electrical isolation, thermal transfer, and adhesion layer for the substrates that are created for your specific needs.

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A highly thermally conductive insulated metal substrate (IMS) consisting of an aluminum base, an epoxy-based insulation layer with a high inorganic content filler demonstrating high thermal conductivity, and a conductive foil, thereby realizing thermal resistance equivalent to, or less than that of an alumina ceramic substrate.

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